Description

The new microscope optics for the optris Xi 400 infrared camera allows reliable temperature measurement on tiny objects from 240 µm.

In combination with a suitable stand, this enables professional measurement of printed circuit boards and components in the electronics industry. The measuring distance between camera and object is variable between 90 and 110 mm. The built-in motor focus allows for an easy focussing of the camera with the included PIX Connect software.

Important specifications

• Analysis of smallest components down to 240 µm
• Easy handling thanks to motor focus
• Recording of radiometric videos
• Optical resolution: 382×288 px

• Scope of supply:
Process imager Xi 400
USB cable (1 m)
Standard PIF cable (1 m) incl. terminal block
Mounting bracket with nut
Software package optris PIX Connect
• Detector: FPA, uncooled (17 µm pitch)
• Optical resolution: 382 x 288 pixels
• Spectral range: 8 – 14 µm
• Temperature range (scalable via programming keys or software):
–20 °C … 100 °C
0 °C … 250 °C
(20) 150 °C … 900 °C 1)
• Frame rate: 80 Hz / 27 Hz
• Microscope optics:
18° x 14° (f = 20 mm)
• Smallest measuring spot (FOV): 81 µm @ 90 mm
• Instantaneous Field of View (IFOV): 80 µm
• MFOV: 240 µm @ 90 mm
• Focus: Manual motor focus
• Distance-to-spot ratio: 390:1 (18° optics)
• Thermal sensitivity (NETD): 80 mK @ 27 Hz
• System accuracy (at ambient temperature 23 ± 5°C): ±2 °C or ±2 %, whichever is greater
• PC interface: USB 2.0 / optional USB to GigE (PoE) conversion
• Process interface (PIF):
Standard PIF:
0–10 V input, digital input (max. 24 V), 0–10 V output